Metrology & Instrumentation
Process Equipment
Epitaxial Equipment
Process Equipment
Lapping/Dicing - Systems
Optium ADS 160 Advanced Dicing System
Advanced dicing system for wafer split/trim, row slice, dice, and relief cut applications, with optional automated bar handling.
Advanced dicing system for wafer split/trim, row slice, dice, and relief cut applications, with optional automated bar handling.
Optium ASL 200 Lapping System
Hard disk head lapping system offering exceptional control of TFMH performance characteristics.
Hard disk head lapping system offering exceptional control of TFMH performance characteristics.